
The countdown begins to the upcoming Xbox 360. IBM recently revealed details of the PowerPC processor that will be used for the upcoming Microsoft Xbox 360 game console. IBM’s P
owerPC chip will inadvertently face off with the "Cell" chip that the company is co-developing with Sony and Toshiba for the Xbox 360 rival, Sony PlayStation 3. The PowerPC chip for the Xbox 360 will already be 64-bit since its predecessor was installed in many IBM server models. The company used its 90-nanometer manufacturing plants in New York, USA and Singapore to produce the custom-made chip. The
PowerPc Processor chip includes three of these cores, each with two simultaneous threads and clock speeds greater than 3 GHz. It features 165 million transistors and is fabricated using IBM’s 90 nanometer Silicon on Insulator (SOI) technology to reduce heat and improve performance. The chip’s innovative 21.6 GB/s Front Side Bus (FSB) Architecture was customized to meet the demanding throughput and latency requirements of the Xbox 360 gaming platform software.
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